網(wǎng)站首頁
公司介紹
 OrganizationThe SUSS MicroTec Group is a leading supplier of equipment and process solutions for microstructuring applications with more than sixty years of engineering experience. Our portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding and photomask processing, complemented by micro-optical components. The production of memory chips, cameras for mobile phones or tire pressure sensors – the equipment solutions of SUSS MicroTec are applied within a wide variety of manufacturing processes for applications of daily or industrial use. Customers in the semiconductor industry and related markets like Advanced Packaging, MEMS and LED appreciate our comprehensive experience in wafer processing. This makes us a valuable partner for high-volume production as well as for research and development.
 Our product portfolioOur portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding and photomask processing, complemented by micro-optical components.
LocationsThe corporate headquarters of SÜSS MicroTec AG is located in Garching near Munich, Germany. The group encompasses production sites as well as sales offices in Asia, Europe and North America. |
| 公司名稱： | 蘇思貿(mào)易（上海）有限公司 | 公司類型： | 企業(yè)單位 (貿(mào)易商,服務(wù)商) |
| 所 在 地： | 中國/上海市 | 公司規(guī)模： | 50-99人 |
| 注冊資本： | 20萬美元 | 注冊年份： | 2012 |
| 資料認(rèn)證： | |||
| 經(jīng)營模式： | 貿(mào)易商,服務(wù)商 | ||
| 經(jīng)營范圍： | 公司主營產(chǎn)品：硅片、晶圓鍵合機、涂布機等 | ||
| 主營行業(yè)： |
|