網(wǎng)站首頁

中|EN

首頁 » 技術(shù)服務(wù)館 » 工藝方案設(shè)計 » 封裝 » 正文

SOP PACKAGES

發(fā)表于：2017-12-27  作者：mql12532  關(guān)注度：355

 SOP PACKAGES
Anst offers a wide variety of SOP (Small Outline Package) in the popular "gull-wing" lead format. Body sizes range from 3 x value="3" unitname="mm">3mm for the MSOP to the 11.2 x value="20.5" unitname="mm">20.5mm wide body SOIC. Lead counts range from 8 to 48 with lead pitches from value=".5" unitname="mm">0.5mm to value="1.27" unitname="mm">1.27mm.

Availability

SOP

Small Outline Package

HSOP

Heat-sink Small Outline Package

SOIC

Small Outline Integrated Circuit

SSOP

Shrink Small Outline Package

QSOP

Quarter-pitch Small Outline Package

TSSOP

Thin Shrink Small Outline Package

MSOP

Mini Small Outline Package

FCSOIC

Flip Chip Small Outline Package

Package Type

Lead Count

(FC)SOIC(EP) (150mil)

7 / 8 / 14 /16

SOIC (208mil)

8

SOIC (300mil)

16 / 20 / 24 / 28

SOIC (330mil)

28

SOIC (440mil)

32

HSOP (300mil)

28

SSOP(5.3mm)

20 / 24 / 28

SSOP(6.0mm)

24

SSOP(7.5mm)

48

MSOP(EP)(3.0mm)

8,10

TSSOP(4.4mm)

8 / 14 / 16 / 20 / 24 / 28

TSSOP(6.1mm)

48

QSOP(3.9mm)

20 / 24 / 28

FCSOIC

8/16

SOP(3.9mm)

nth="8" year="2016" w_x003a_st="on">8 / 14 / 16

SOP(5.1mm)

20

SOP(7.5mm)

18 / 24 / 28 / 32

商家資料

提示：注冊 查看!

服務(wù)熱線

4001027270

功能和特性

價格和優(yōu)惠

微信公眾號