服務(wù)熱線
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特點(diǎn)
Tbon-100 Wafer Bonder的特點(diǎn)包括:
(1) 高產(chǎn)出率
(2) 高製程品質(zhì)再現(xiàn)性與穩(wěn)定性
(3) 全自動(dòng)操控介面
(4) 模組化設(shè)計(jì),最小的使用面積。
規(guī)格
Wafer Numbers / Sizes 1 pairs / (2"- 6")
Press Force 3.5 ~ 10 KN (Option)
Upper/Lower Temperature Control 350 ~ 700 oC (Option)
base Pressure < 1 Torr
Pumping System Oil-Free Dry pump
Automatic Control System Industrial HMI with Graphic User Interface
Power Requirement AC220V, 3 phase, 60 Hz, 30A,
Dry N2 Requirement 1.2 kgw/cm2
CDA Requirement 5 kgw/cm2
Water Requirement 1.5 kgw/cm2, 20℃, 10 l/min
Dimension (WxDxH) 850 x 800 x 1650 (mm)
Weight 120 kgw
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