服務(wù)熱線
4001027270
Tool Description:
1.Software: Windows XP
2.Good Solution for the Depcasulation Processing
3.The Best Solution of Copper Bonding Material Opening.
4.The Etch Rate Is Controllable and the Good Etch Uniformity.
5.Convenient Failure Analysis Tool for PCBA or BGA Substrate Sample Preparation.
Applied Package Types:
QFP, QFN, SOT
TO, DIP
BGA
COB, Assembly types
Short Processing Time in ASIC and Power Chip
MCM Sample Opening
Customized Area Opening
The Total Solution of Stacked Chip Opening.
The Copper Wire Bonding Decapsulation.
Adjusted Etch Rate to Control the Decapsulated Well.
The Package 2nd Bonding Inspection with Laser Decapsulation.
The PCB or BGA substrate Delayer Inspection.
Failure Analysis for the Copper Crack or Electrical Probing.
The Sample Preparation for Molding Compound Removal and Cross-section.
The Specific Shape Opening Is Available.
儀準(zhǔn)PST2000型激光開封機(jī)最大特點(diǎn),性價(jià)比高
整體性能可以和歐美品牌相媲美,價(jià)格卻有很大競爭優(yōu)勢。
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中國知名客戶有:廣州電子五所、宜碩科技(上海、北京)、航天201所、南瑞集團(tuán)、華進(jìn)半導(dǎo)體等
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