服務(wù)熱線
4001027270
功能:精準(zhǔn)找出晶圓上下層集成電路對位偏移量
應(yīng)用范圍:半導(dǎo)體、光電、光通訊等
技術(shù)參數(shù)/General specifications:
技術(shù)(Technology):紅外CCD(IR CCD)
視場(FOV):0.8mm*0.5 mm和1.25μm分辨率
(0.8mm x 0.6mm with 1.25 um resolution)
襯底(Substrate):硅,砷化鎵(Si, GaAs)
測量參數(shù)(Measure parameter):重疊和CD自動(dòng)分析(Overlap & CD (Auto analysis))
光源(Light source):明場&透射光場照明
(Bright field & transmitted bright field illumination)
關(guān)鍵詞(Keyword):3D、IC、重疊(overlap)
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