晶圓分揀機和處理解決方案

OAI自動化系統(tǒng)提供各種晶片處理解決方案。系統(tǒng)可以配置為50mm（2“）的化合物半導體晶片高達300mm的硅晶片。人機工程學操作界面和Windows NT平臺允許輕松設(shè)置工藝配方模塊化結(jié)構(gòu)與高可靠性，低維護設(shè)計，從而提高設(shè)備生產(chǎn)率。

OAI，超潔凈機器人處理機在世界一流的潔凈室環(huán)境中運行，可配置為與300mm FOUP晶片傳輸系統(tǒng)連接。在另一個極端，我們專門處理易碎的GaAs和InP晶片。我們?yōu)槟奶囟ㄐ枨筇峁┒ㄖ频淖詣踊鉀Q方案：晶圓裝載和卸載，分揀，轉(zhuǎn)移，OCR讀取，裝箱和檢查。
Wafer Sorters and Handling Solutions

OAI Automation Systems offer a wide range of wafer handling solutions. Systems can be configured for 50mm (2") compound semiconductor wafers up to 300mm silicon wafers. The ergonomic operator interface and Windows NT platform allow easy set-up of process recipes. Modular construction is coupled with a high-reliability, low maintenance design, leading to improved equipment productivity.

OAI, ultra-clean robotic handlers operate in world-class clean room environments and can be configured to interface with 300mm FOUP wafer transport systems. At the other extreme, we specialize in handling fragile GaAs and InP wafers. We offer customized automation solutions for your specific needs: wafer loading & unloading, sorting, transferring, OCR reading, binning and inspection.

晶圓分揀機

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